SYS-CLEAN© BC1.0
PCB Cleaner – concentrated
SYS-CLEAN© BC1.0 is a water-based cleaning medium for flux removal of printed circuit boards, ceramic substrates and lead frames.
SYS-CLEAN© BC1.0 is well suited to prepare surfaces for subsequent wire bonding and coating processes. The cleaning agent is suitable for spray-in-air and spray-underimmersion.
SYS-CLEAN© BC1.0 is specially additive to protect sensitive surfaces from undesired chemical reactions.
Advantages: SYS-CLEAN© BC1.0 is configured extremely gently and has a good cleaning performance. The high loading capacity with the best filterability ensures a particulare costeffective process. The cleaner can be used in the spray process as well as in immersion systems.
Availability: SYS-CLEAN© BC1.0 concentrate is available in the following sizes:
- Item number: 64904708 – 25L
Area of application
Pollution | Suitability |
---|---|
Low solid flux | ✓ ✓ |
Colophonium flux | ✓ ✓ |
Water soluble flux | ✓ ✓ |
Solder paste leaded / unleaded | ✓ ✓ |
SMT adhesives | ✓ |
Type of application
Cleaning method | Suitability |
---|---|
Spray-in-air | ✓ ✓ |
Immersion cleaning air agitated | ✓ ✓ |
Spray under Immersion | ✓ ✓ |
Ultrasonic | ✓ ✓ |
Manual cleaning | ✓ |
Application parameters
Parameter | Value |
---|---|
Application temperature | 40 - 60°C |
Cleaning time | approx. 10 - 30 min. |
Rinsing | DI-Water |
Drying | convection/ compressed air |
Application concentration | 15 – 30% in DI-Water |
✓ ✓ = Excellent ✓ = Optimal O = Optional X = Not recommended
Technical data
SYS-CLEAN© BC1.0 is delivered as a concentrate
pH-Value | 10,5 |
Density (at 20°C) | 0,995 g/cm³ |
Refractive Index (at 20°C) | 1,4135 |
Flashpoint | > 60° C |
Initial boiling point and boiling range | > 100° C |
Data sheet
for download
- SYS-CLEAN_BC1.0.pdf299 KB
REACH
compliant
The product is free from ingredients of concern according to the SIN & SVHC lists
RoHS & WEEE
compliant
100% compliant with EU directives RoHS 1 & 2, WEEE