SYS-CLEAN© BC1.0

PCB Cleaner – concentrated

SYS-CLEAN© BC1.0 is a water-based cleaning medium for flux removal of printed circuit boards, ceramic substrates and lead frames.

SYS-CLEAN© BC1.0 is well suited to prepare surfaces for subsequent wire bonding and coating processes. The cleaning agent is suitable for spray-in-air and spray-underimmersion.

SYS-CLEAN© BC1.0 is specially additive to protect sensitive surfaces from undesired chemical reactions.

Advantages: SYS-CLEAN© BC1.0 is configured extremely gently and has a good cleaning performance. The high loading capacity with the best filterability ensures a particulare costeffective process. The cleaner can be used in the spray process as well as in immersion systems.

Availability: SYS-CLEAN© BC1.0 concentrate is available in the following sizes:

  • Item number: 64904708 – 25L

Area of application

Pollution Suitability
Low solid flux ✓ ✓
Colophonium flux ✓ ✓
Water soluble flux ✓ ✓
Solder paste leaded / unleaded ✓ ✓
SMT adhesives

Type of application

Cleaning method Suitability
Spray-in-air ✓ ✓
Immersion cleaning air agitated ✓ ✓
Spray under Immersion ✓ ✓
Ultrasonic ✓ ✓
Manual cleaning

Application parameters

Parameter Value
Application temperature 40 - 60°C
Cleaning time approx. 10 - 30 min.
Rinsing DI-Water
Drying convection/ compressed air
Application concentration 15 – 30% in DI-Water

✓ ✓ = Excellent         = Optimal        O = Optional        X = Not recommended

   
pH-Value 10,5
Density (at 20°C) 0,995 g/cm³
Refractive Index (at 20°C) 1,4135
Flashpoint > 60° C
Initial boiling point and boiling range > 100° C

The product is free from ingredients of concern according to the SIN & SVHC lists

100% compliant with EU directives RoHS 1 & 2, WEEE