SYS-CLEAN© STC1.0

Stencil cleaner – ready-to-use

SYS-CLEAN© STC1.0 is a water-based cleaning medium for cleaning SMT stencils already at room temperature.

SYS-CLEAN© STC1.0 reliably cleans solder pastes from stencils and misprints.The cleaner can be used in spray processes as well as in immersion or ultrasonic systemswill be.

Advantages: SYS-CLEAN© STC1.0 is very well filterable and has an optimized discharge behaviour which reduces consumption and prevents oily residues. The high loading capacity ensures a particularly cost-effective process. Since the medium does not separate, use in underside cleaning is possible without problems.

Availability: SYS-CLEAN© STC1.0 ready-to-use is available in the following sizes:

  • Item number: 64904042 – 1L
  • Item number: 64903565 – 5L
  • Item number: 64903511 – 25L
  • Item number: 64903512 – 200L
stc1_0

Area of application

Pollution Suitability
Solder pastes ✓ ✓
SMT adhesive or conductive adhesive ✓
Flux ✓
Oils/fats ✓

Type of application

Cleaning method Suitability
Spray-in-air ✓ ✓
Immersion cleaning air agitated ✓ ✓
Spray under Immersion ✓ ✓
Ultrasonic ✓ ✓
Manual cleaning ✓

Application parameters

Parameter Value
Application temperature 20°C
Cleaning duration approx. 4 - 6 min.
Rinsing STC1.0 / DI-Water
Drying convection / compressed air
Application Concentration ready-to-use

✓ ✓ = Excellent        ✓ = Optimal        O = Optional        X = Not recommended

   
pH-Value 7,7
Density (at 20°C) 0,995 g/cm³
Refractive Index (at 20°C) 1,3522
Flashpoint n. A.
Initial boiling point and boiling range > 100° C
Reach

The product is free from ingredients of concern according to the SIN & SVHC lists

RoHS

100% compliant with EU directives RoHS 1 & 2, WEEE