SYS-CLEAN^© US1.5

Ultrasonic cleaner - ready to use

SYS-CLEAN© US1.5 is a water based cleaning medium for cleaning SMT stencils in ultrasonicsystems.

SYS-CLEAN© US1.5 contains inhibitors that effectively prevent attack on aluminum,copper and non ferrous metals.Fast run off of the cleaner liquor, therefore practically residue free surface. The ultrasonic cleaner reliably cleans solder pastes and SMD adhesives without additional rinsing.

Advantages: SYS-CLEAN© US1.5 the high loading capacity ensures a particularly cost effective process. The cleaner dries very quickly and does not leave any oily residues.

Environmental protection: SYS-CLEAN© US1.5 is water based and biodegradable. The cleaner dries without leaving residues, so no water rinsings is required and no waste water is produced.

Availabillity: SYS-CLEAN© US1.5 is available in the following sizes:

Item number: 64907367 - 25L

Area of application

Pollution	Suitability
Solder pastes	✓ ✓
Glue	✓ ✓
Flux	✓
Oils/fats

Type of application

Cleaning method	Suitability
Spray-in-air	X
Immersion cleaning air agitated	X
Spray under Immersion	X
Ultrasonic	✓ ✓
Manual cleaning	X

Application parameters

Parameter	Value
Application temperature	60°C
Cleaning duration	approx. 15 - 30 min.
Rinsing	unnecessary
Drying	convection / compressed air
Application concentration	ready-to-use

✓ ✓ = Excellent ✓ = Optimal O = Optional X = Not recommended

Technical data

SYS-CLEAN^© US1.5 is delivered as a ready-to-use mix.


pH-Value	8,1 – 8,4
Density (at 20°C)	0,98 g/cm³
Refractive Index (at 20°C)	1,400 bis 1,410
Flashpoint	> 100 °C
Initial boiling point and boiling range	n. A.