SYS-CLEAN© STC4.0
Stencil cleaner – ready-to-use
SYS-CLEAN© STC4.0 is a cleaning medium for cleaning SMT print stencils already at room temperature.
SYS-CLEAN© STC4.0 reliably cleans solder pastes and especially SMT adhesives in one process The cleaner completely removes problematic pigment residues of SMT adhesives.
SYS-CLEAN© STC4.0 is also suitable for cleaning misprinted assemblies. The cleaner can be used both in a spray process and in immersion or ultrasonic systems.
Advantages: SYS-CLEAN© STC4.0 is very well filterable and has an optimized discharge behavior which reduces consumption. The high loading capacity ensures a particularly costeffective process. The medium must be rinsed with water.
Availability: SYS-CLEAN© STC4.0 ready-to-use is available in the following sizes:
- Item number: 64902863 – 25L
Area of application
| Pollution | Suitability |
|---|---|
| Solder pastes | ✓ ✓ |
| SMT adhesive or conductive adhesive | ✓ ✓ |
| Flux | ✓ |
| Oils/fats | ✓ |
Type of application
| Cleaning method | Suitability |
|---|---|
| Spray-in-air | ✓ ✓ |
| Immersion cleaning air agitated | ✓ ✓ |
| Spray under Immersion | ✓ ✓ |
| Ultrasonic | ✓ ✓ |
| Manual cleaning | ✓ |
Application parameters
| Parameter | Value |
|---|---|
| Application temperature | 20°C |
| Cleaning duration | approx. 4 - 6 min. |
| Rinsing | DI-Water |
| Drying | convection / compressed air |
| Application concentration | ready-to-use |
✓ ✓ = Excellent ✓ = Optimal O = Optional X = Not recommended
Technical data
SYS-CLEAN© STC4.0 is delivered as a ready-to-use mix.
| pH-Value | 8,2 |
| Density (at 20°C) | 0,959 g/cm³ |
| Refractive Index (at 20°C) | 1,4321 |
| Flashpoint | > 100° C |
| Initial boiling point and boiling range | > 200° C |
Data sheet
for download
- SYS-CLEAN_STC4.0.pdf286 KB
REACH
compliant
The product is free from ingredients of concern according to the SIN & SVHC lists
RoHS & WEEE
compliant
100% compliant with EU directives RoHS 1 & 2, WEEE
