SYS-CLEAN© STC3.0

Stencil cleaner – ready-to-use

SYS-CLEAN© STC3.0 is a water-based, mild alkaline cleaning medium for cleaning SMT stencils already at room temperature.

SYS-CLEAN© STC3.0 reliably cleans solder pastes and SMT adhesives in one process. The cleaner completely removes problematic pigment residues of SMT adhesives.

SYS-CLEAN© STC3.0 is also suitable for the cleaning of misprinted assemblies that are already loaded on one side. The cleaner can be used in spray processes as well as in immersion or ultrasonic systems.

Advantages: SYS-CLEAN© STC3.0 is very well filterable and has an optimized discharge behavior. The high loading capacity ensures a particularly cost-effective process. The medium is slightly alkaline and therefore best suited for the cleaning of misprints that are already loaded on one side.

Availability: SYS-CLEAN© STC3.0 ready-to-use is available in the following sizes::

  • Item number: 64903515 – 25L
  • Item number: 64903516 – 200
stc3_0

Area of application

Pollution Suitability
Solder pastes ✓ ✓
SMT adhesive or conductive adhesive ✓ ✓
Flux ✓ ✓
Oils/fats ✓

Type of application

Cleaning method Suitability
Spray-in-air ✓ ✓
Immersion cleaning air agitated ✓ ✓
Spray under Immersion ✓ ✓
Ultrasonic ✓ ✓
Manual cleaning ✓

Application parameters

Parameter Value
Application temperature 20°C
Cleaning duration approx. 4 - 6 min.
Rinsing DI-Water
Drying convection / compressed air
Application Concentration ready-to-use

✓ ✓ = Excellent        ✓ = Optimal        O = Optional        X = Not recommended

   
pH-Value 10,4
Density (at 20°C) 1,018 g/cm³
Refractive Index (at 20°C) 1,356
Flashpoint n. A.
Initial boiling point and boiling range > 100° C
Reach

The product is free from ingredients of concern according to the SIN & SVHC lists

RoHS

100% compliant with EU directives RoHS 1 & 2, WEEE