SYS-CLEAN^© STC2.0

Stencil cleaner – ready-to-use

SYS-CLEAN^© STC2.0 is a water-based cleaning medium for cleaning SMT stencils already at room temperature.

SYS-CLEAN^© STC2.0 reliably cleans solder pastes and SMT adhesives in one process. The cleaner completely removes problematic pigment residues of SMT adhesives.

SYS-CLEAN© STC2.0 is also suitable for cleaning misprinted assemblies. The cleaner can be used in spray processes as well as in immersion or ultrasonic systems.

Advantages: SYS-CLEAN^© STC2.0 is very well filterable and has an optimized discharge behaviour which reduces consumption and prevents oily residues. The high loading capacity ensures a particularly cost-effective process. Since the medium does not separate, use in underside cleaning is possible without problems. The cleaner dries very quickly and leaves no oily residue.

Availability: SYS-CLEAN^© STC2.0 ready-to-use is available in the following sizes:

Item number: 64904249 – 1L
Item number: 64904248 – 5L
Item number: 64903513 – 25L
Item number: 64903514 – 200L

Area of application

Pollution	Suitability
Solder pastes	✓ ✓
SMT adhesive or conductive adhesive	✓ ✓
Flux	✓
Oils/fats	✓

Type of application

Cleaning method	Suitability
Spray-in-air	✓ ✓
Immersion cleaning air agitated	✓ ✓
Spray under Immersion	✓ ✓
Ultrasonic	✓ ✓
Manual cleaning	✓

Application parameters

Parameter	Value
Application temperature	20°C
Cleaning duration	approx. 4 - 6 min.
Rinsing	STC2.0 / DI-Water
Drying	convection / compressed air
Application Concentration	ready-to-use